Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
LVDS Cable for screen CQ57 p/n: 350406U00-600-G 350406W00-09M-G 350406Y00-11C-G 350406Y00-1100-1100-11
HAYEAR HY-1070 5 Inch Screen 16MP 4K 1080P 60FPS WIFI Digital Industry Microscope Camera 150X (ang.)
LVDS Cable for screen Acer E1-522 E1-522 E1-522G p/n: 50.4YU001 50.4YU011 50.4YU011 50.4YU01.01 50.4YU021 50.M81N1.
DF40HC(3.0)-40DS-0.4V(51) Socket Connector (ang.)
CM100S Wykaz gatunków Leading Titanium Alloy Solder Soldering Pot Desoldering Bath 500W 110V
AOYUE 20094 HOT AIR GUN HEATING ELEME 20094 (ANG.)
LVDS Cable for screen CQ62 LED p/n: 350401C00-600-G
Halnziye HY910-50ml Thermal Glue (ang.)
5in1 Repair Opening Tools Metal Pry Spudger Disassemble Set
ASUS X58 ASUS X51 (11.1V 4400mAh) PN A32-X51 A32-T12
900M-T-SK KINGBOX 936 bez lutowni
YIHUA 938D Tweezers Soldering Iron Station (ang.)
VETUS ESD-15 Safe Anti-Static Stainless Steel Tweezers (ang.)
S-993A S-995A (ang.) Pump Solder Sucker Gun Suction nozzle
