Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
PZEM-031 4in1 Multifunction DC 6,5~100V 20A
LVDS Cable for screen Asus K42 X42 P/N: 1422-00P1000 1422-00P4000 1422-00P9000 1422-00SK000 1422-00SK000 14G22100200VV 1422-00P4000 1422-00P9000 1422-00SK000 1422-00SK000 1400SK000 14G22100200VVVD
LVDS Cable for screen Asus N56J 40 pin p/n: 14005-01140000 DDNJ8GLC100 14005-01140100
LVDS Cable for screen HP Elitebook 6930p p/n: 50.4V907.001 50.4V907,002 50.4V907,004V920.0
HDMI USB1080P Oficjalna strona Repair Industrial Work Set
25 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU (ang.) Zarząd dla Arduino TFG
ELP41 Bare lampa dla EMP-S5/EMP-X5E/PowerLiteLite HC 700/H283A Projektor
LVDS Cable for screen Acer 5744 p/n: 1422-0135000 50V5M0U
DC Power Supply DPS-305CF Digital Control DC Voltage
HAYEAR 34MP 2K 1080P 60FPS HDMI USB Digital Microscope Industrial Camera Magnifier (ang.)
LCD HP Pavilion G6-2000 G6-2238DX Laptop DD0R36LC020
2,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
FOXCONN CPU Sockel mPGA 479M BGA socket
Foxcon Socket LGA2011 CPU Strona BGA baza danych
