CP2515 Goot Wick Desoldering (ang.)

2,74 €
Netto

CP-2515 Goot Wick Desoldering (ang.)

Chipsetpro.com

Chipsetpro.com

Ilość
Delivery will take 14-28 days

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003181

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CP2515 Goot Wick Desoldering (ang.)

CP-2515 Goot Wick Desoldering (ang.)

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