Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base
Part Number LGA1150 Socket Manufacturer Foxconn
BGA Alloy No Pb/Lead Free Socket type BGA1150
Package/Case 1 PCS Description Brand New
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
Toshiba Satellite C850 C855 C875 C870 L870 L870 L870 L875 C870 C55 – 3 piny
LVDS Cable for screen Lenovo B50-30 B50-45 B50-70 (touch) (ang.)
25 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
FPC FFC 1.0 mm Pitch for Laptop keyboard interface
Microscope 144 LED (ang.) Ring Light Illuminator (ang.)
LVDS Cable ASUS K56C K56C K56C K56CA S56C 14005-00600000
900M-T-2.4D KINGBOX 936 bez lutowni
T13-KU BaKon zintegrował ogrzewanie rdzenia bezprzewodowego o stałej temperaturze 75W
Bateria dla HP ProBook 4510s 4515s 4710s (10,8V 5200mAh) PN: PN HSTNN-IB89 HSTNN-OB88
LVDS Cable for screen Acer E1-521 E1-531 E1-571 V3-571 p/n, DC02001F010 40pin (ang.)
Super Strong Suction Cup Tool LCD Okładka
Titanium Alloy Advanced polarized Glasses Smudge Guard Sunglasses-Advanced 100% UV (ang.)
Foxcon Socket LGA2011-V3 CPU Strona BGA baza danych
LVDS Cable for screen Lenovo B580 B590 V580 p/n: 50.4TE09.001 50.4TE09.011 50.4TE09
110V 60W Simple metal Soldering iron Stand (ang.)
Foxcon H3 Socket LGA1150 (ang.) baza danych
