Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
LVDS Cable dla ekranu Asus X453MA F453M p/n: DD0XK1LC000 14005-01250000 14005-012502002
Honton HT-1212 (ang.) Współczynnik stałej temperatury spaliny 220V
C229 Mobile SIM Card Reader All-in-1 to USB2.0 PC (ang.)
Silicone Heat Mat Repair (ang.) Tablice Fones Fix Pad 460 300 mm
900M-T-3C KINGBOX 936 bez lutowni
Acer Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E
AOYUE 20094 HOT AIR GUN HEATING ELEME 20094 (ANG.)
LVDS Cable for screen Dell N5030 M5030 N5020 15V P/N: 50.4EM03.101 042CW8 50.4EM03.001 50.4EM03.
Bateria Sony SVT-14 SVT-15 (11,4V 3760mAh) VGP-BPS33-15 (ang.)
Cooling Fan for MSI GE60 MS-16GA (ang.)
LVDS Cable for screen Acer 5349 5749 p/n: DD0ZRLLC000 DD0ZRLLC010 DD0ZRLLC020 DD0ZRLLC020
Aluminium Foil Tape 10mm Roll Ideal For Heat Reflection (ang.)
USB 3.0 To SATA 22 Pin 2.5,5 Inch Hard Disk Driver SSD Adapter Cable Converter (ang.)
431 Czarna Plastyka Round Handle Anti Static ESD Brush (ang.)
6 Port Multifunctional charging więcej niż USB Brakket
PGA 544H LGA775 Intel Okładka
