Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
TMS91429CT Nowe Transformer dla SAMSUNG 943NW 953BW
0,3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate (ang.)
NMB 1606KL-04W-B30 DC12V 0.09A 40*40*15mm 2pin Cool Fan (ang.)
LVDS Cable for screen Lenovo B560 V560 V570 P/N: 50.4JW09.001 31045737 50.4JW09
Aspire ONE 521 522 532 533 D255 D257 D260 D270 Black US Keyboard (ang.)
LVDS Cable Acer Aspire E1-531 50.M09N2.005 (ang.)
AOYUE B003 Replacement Soldering Iron Handel Tip Compatible (ang.)
Racksoi 3in1 Black Plastic Round Handle (ang.)
Teensy 3.2 MK20DX256 – chlebowa tablica rozwojowa z ładunkiem funkcji
LVDS Cable for screen Dell 3521 p/n: DC020022P000005JWND (ang.)
Universal 12.7 mm SATA 2 SSD HDD Hard Drive Caddy na DVD Optical Bay
CM141 Lead-Free Titanium Alloy Soldering Pot Desoldering Bath 900W 110V (ang.)
Oficjalna strona Wrist Strap Band Discharge PC Electric Grounds (ang.)
Inverter Transformer 8TC0049901 GP dla SAMSUNG 2243BW LCD TV
Asus X451CA X551CA X451CA X451X551 (ang.)
PGA 544H LGA775 Intel Okładka
