Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
T13-IL BaKon zintegrował ogrzewanie rdzenia bezprzewodowego 75W stałej temperatury lutowania żelaza
OFICJALNA STRONA Wielokrotny kierowca śrubowy Household, Mobile phone i obsługa komputerów
40 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
LVDS Cable for screen Acer E1-422 E1-430 E1-432 V3-470 p/n: 504OD00101 50.4YP01.001 50.MDDN1.0 (ANG.)
LVDS Cable for screen Toshiba L650 L655 p/n: A000075860 DD0BL6LC030 DD0BL6LC010LC010
1,5m OMEGA K-TYPE Thermocouple TT-K-30-SLE
110ml Multifunctional Adhesive Glue B-7000 For Mobile Phone Universal (ang.)
DH-A1L-C Digital display of the ferrochrome laser position
AA07A-S010VA1 10pin 0.4mm Spacing JAE Connector (ang.)
Teensy 3.2 MK20DX256 – chlebowa tablica rozwojowa z ładunkiem funkcji
ASUS X58 ASUS X51 (11.1V 4400mAh) PN A32-X51 A32-T12
DC Power Supply DPS-305CM Digital Control DC Voltage
250KTC 055mm Sn965/Ag3/Cu0.5 BGA (ang.) Oficjalna strona Pb/Lead Free Solder Ball
LVDS Cable for screen Sony SVE17 P/N: 50.4MR05
Foxcon Socket G34 LGA1944 CPU BGA Connector Holder for AMD Server Desktop Opteron Processor
2.0m S-993A S-995A Pump Solder Sucker Gun Suction nozzle
