Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
LVDS Cable Asus K54 p/n 1422-01B000
Bateria Sony VAIO VGP-BPS13 (11.1V 4400mAh) (ang.)
USB2.0 – czytelnik karty wysokiej prędkości MS.CFTF.SD 6in1
Wireless Smart 5USB Display Charger 818PF (ang.)
900M-T-1.2D KINGBOX 936 bez lutowni
LVDS Cable for screen Toshiba A300 p/n: DD0BL5LC000 DD0BL5LC100 DD0BL5LC300 GLEDD0BL5LC000
0,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
YIHUA 938D Tweezers Soldering Iron Station (ang.)
15.6 Laptop LED to LCD CCFL (ang.)
CMT-1025 Stainless Steel Welding Soldering (ang.)
6 Port 6A Auto Detect USB (ang.) Oficjalna strona internetowa linii kolejowej Display
LVDS Cable dla ekranu Packard Bell EasyNote TJ62 TJ65 TJ72 p/n: 50.4BU001 50.4BU01
YAOGONG 8878D 2in1 REWORK STATION (ang.)
CP-3015 Goot Wick Desoldering (ang.)
