Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
7# SATA Hard Disk Power Line Transfer Line 4 – pinIDE dla linii SATA
LVDS Cable for screen Toshiba C850 L850 L850 P/n: 1422-017D000 1422-017J000 1422-018H000 H00000000300
LVDS Cable for screen Lenovo B560 V560 V570 P/N: 50.4JW09.001 31045737 50.4JW09
LVDS Cable for screen 15-ay p/n: DC020026M00 813943-001 (ang.)
Cool Fan for Toshiba Satellite L300 M300 M305 M803 M805 (ang.)
UNO R3 ATmega328P CH340 Mini USB Strona internetowa Compatible-Arduino FF
2.0m S-993A S-995A Pump Solder Sucker Gun Suction nozzle
Weller LT1L TIP Round 0,2 MM WSP80 Sillver Series (ang.)
0,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
LVDS Cable for screen Samsung R530 R538 R580 R525 R528 R540 RV510 P/N: BA39-00951A BA39-0093
BGA naprawiono Nozzle, ZhuoMao Dinghua OKI Hongten Scotle Titanium Alloy Nozzle
3# SATA Hard Disk Power Line Transfer Line 4 pinIDE to serial Connection Line
40 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
Screen Protection/Removal High Temperature Resistance Screen Refurbish Tape 80mm*50m (ang.)
AMD S1 Intel Baza BGA
