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i54300U SR1ED Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003351
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

5,47 €

i5-4300U SR1ED Stencil Template (ang.)

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10pc Screw Lot for Apple Macbook Pro 13 17 A1278 A1286 A1297 (ang.) Bottom Case

100% brand new and high quality

Color: As picture showed.

Material: Metal.

Quantity: 10pcs/set

Compatible With:

MacBook Pro 13" A1278 2009 2010 2011 2012

MacBook Pro 15" A1286 2008 2009 2010 2011 2012

MacBook Pro 17" A1297 2009 2010 2011

Package Includes:

10pcs * Bottom Case Screw (3 Long 7 Short)

CH003544
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

3,73 €

10pc Screw Lot for Apple Macbook Pro 13 17 A1278 A1286 A1297 (ang.) Bottom Case

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ISL6258AHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003546
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

3,45 €

ISL6258AHRTZ

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Smd Inducer Test Tweezer Forceps For Resistance Multimeter Probe (ang.)

The video probe is suitable for resistor, capacitor or other surface mount components

This is a handy tool that you need for the job

Maximum voltage: 250

Open the clip distance: 10 mm

High quality of the screened coaxial cable

Universal multifunctional multimeter plug

Ease of use

Protective caps for the probe tips

The depth of 15 mm connector

Ease of capture probes with the anti slip design

Color: black

Size: approx. 15x1.8x1.5 see

The list of packages:

1 * test clip sensor meter

CH003694
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

5,59 €

Smd Inducer Test Tweezer Forceps For Resistance Multimeter Probe (ang.)

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eMMC100 BGA100 IC testowanie Nand flash Pitch 10mm Reader m

BGA100 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 14x18mm ( buy eMMC100 test socket , get 1 piece complimentary frame guides )

Feature:

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix and Intel.

2. With 88pins and pin pitch 1.0mm, eMMC size 14x18mm , we also provide another type of size 12x18

3. Apply to eMMC thickness of 0.6mm to 2.0mm.

4. Test can be carried out with or without balls.

5. This product applies to BGA 100.

6. Easy operation by inserting USB to your PC directly.

CH003807
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

100,70 €

eMMC100 BGA100 IC testowanie Nand flash Pitch 1.0mm Reader m

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i73632QM SR0UZ Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003814
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

5,40 €

I7-3632QM SR0UZ Stencil Template (ang.)

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Obsługa stacji BGA Solder Magnet90

Buy Chip Repair Tool: * B&R 43in1 Chip Repair Tool Set CPU Scraper Removal Chip

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000067
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

65,00 €

ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)

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BD82Q67 SLJ4D

BD82Q67 SLJ4D

Part Number BD82Q67 SLJ4D Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1321

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004112
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

30,03 €

BD82Q67 SLJ4D

i54300U SR1ED Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003351

Chipsetpro.com

Chipsetpro.com

5,47 €

i5-4300U SR1ED Stencil Template (ang.)

wishlist
Compare

10pc Screw Lot for Apple Macbook Pro 13 17 A1278 A1286 A1297 (ang.) Bottom Case

100% brand new and high quality

Color: As picture showed.

Material: Metal.

Quantity: 10pcs/set

Compatible With:

MacBook Pro 13" A1278 2009 2010 2011 2012

MacBook Pro 15" A1286 2008 2009 2010 2011 2012

MacBook Pro 17" A1297 2009 2010 2011

Package Includes:

10pcs * Bottom Case Screw (3 Long 7 Short)

CH003544

Chipsetpro.com

Chipsetpro.com

3,73 €

10pc Screw Lot for Apple Macbook Pro 13 17 A1278 A1286 A1297 (ang.) Bottom Case

wishlist
Compare

ISL6258AHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003546

Chipsetpro.com

Chipsetpro.com

3,45 €

ISL6258AHRTZ

wishlist
Compare

Smd Inducer Test Tweezer Forceps For Resistance Multimeter Probe (ang.)

The video probe is suitable for resistor, capacitor or other surface mount components

This is a handy tool that you need for the job

Maximum voltage: 250

Open the clip distance: 10 mm

High quality of the screened coaxial cable

Universal multifunctional multimeter plug

Ease of use

Protective caps for the probe tips

The depth of 15 mm connector

Ease of capture probes with the anti slip design

Color: black

Size: approx. 15x1.8x1.5 see

The list of packages:

1 * test clip sensor meter

CH003694

Chipsetpro.com

Chipsetpro.com

5,59 €

Smd Inducer Test Tweezer Forceps For Resistance Multimeter Probe (ang.)

wishlist
Compare

eMMC100 BGA100 IC testowanie Nand flash Pitch 10mm Reader m

BGA100 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 14x18mm ( buy eMMC100 test socket , get 1 piece complimentary frame guides )

Feature:

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix and Intel.

2. With 88pins and pin pitch 1.0mm, eMMC size 14x18mm , we also provide another type of size 12x18

3. Apply to eMMC thickness of 0.6mm to 2.0mm.

4. Test can be carried out with or without balls.

5. This product applies to BGA 100.

6. Easy operation by inserting USB to your PC directly.

CH003807

Chipsetpro.com

Chipsetpro.com

100,70 €

eMMC100 BGA100 IC testowanie Nand flash Pitch 1.0mm Reader m

wishlist
Compare

i73632QM SR0UZ Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003814

Chipsetpro.com

Chipsetpro.com

5,40 €

I7-3632QM SR0UZ Stencil Template (ang.)

wishlist
Compare

Obsługa stacji BGA Solder Magnet90

Buy Chip Repair Tool: * B&R 43in1 Chip Repair Tool Set CPU Scraper Removal Chip

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000067

Chipsetpro.com

Chipsetpro.com

65,00 €

ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)

wishlist
Compare

BD82Q67 SLJ4D

BD82Q67 SLJ4D

Part Number BD82Q67 SLJ4D Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1321

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004112

Chipsetpro.com

Chipsetpro.com

30,03 €

BD82Q67 SLJ4D

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Compare
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