N11P-GE1-W-A3 G330M
Part Number N11P-GE1-W-A3 Manufacturer NVIDIA
BGA Alloy No Pb/Lead Free Date Code 1327
Package/Case 360 PCS Description Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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CH003349
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N11P-GE1-W-A3 G330M
